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Accelerate Your Automotive, Consumer, and Data Center Semiconductor Projects
Semiconductor innovation is the driving force behind groundbreaking advancements in automotive technology, consumer electronics, and data centers. From powering energy-efficient products to enabling...
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Accelerate the Photonic IC Design with Cadence EPDA Environment
Do you believe the existing semiconductor methodologies will adequately support the ever-increasing data rate and latency? Transistor scaling has always existed, but increasing parasitics with smaller...
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Enkl Sound Elevates Audio Tech with Tensilica HiFi DSP for Unmatched Excellence
In the rapidly evolving world of audio technology, Enkl Sound Copenhagen emerges as a beacon of innovation, blending timeless Scandinavian design with the pulsating heart of cutting-edge digital sound...
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eUSB2 Version 2 with 4.8Gbps and the Use Cases: A Comprehensive Overview
When developing system-on-chip (SoC) solutions, the key features often minimize size, maximize performance, and achieve low power consumption while decreasing costs. These requirements are true for...
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Symmetric Multiprocessing (SMP) RTOS on Xtensa Multicore
An increasing number of multi-threaded embedded applications want to leverage multicore designs. Symmetric Multiprocessing (SMP) RTOS provides automatic load balancing of multiple threads in a...
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AI's Rapid Growth: The Crucial Role of High Bandwidth Memory
System efficiency is dictated by the performance of crucial components. For AI hardware systems, memory subsystem performance is the single most crucial component. In this blog post, we will provide an...
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Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process
We are thrilled to announce that Cadence has successfully demonstrated first-pass silicon success of its UCIe™ standard package IP on Samsung Foundry's 5nm automotive process. This milestone...
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How Physical AI Is Redefining the Automotive Industry
The automotive world is experiencing a groundbreaking transformation, with technology and AI-driven innovation at its core. Among the most significant advancements is the rise of physical AI, a concept...
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Functional Safety in a Disaggregated World
We are witnessing a dramatic rise in disaggregation and a lot of discussion around chiplet-based design. There are multiple reasons for it: as monolithic dice grow larger, they hit reticle limits and...
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HBM4 Boosts Memory Performance for AI Training
The recent HBM4 specification announced by JEDEC is great news for developers of AI training hardware. HBM4 is the latest specification in the rapidly evolving High Bandwidth Memory (HBM) DRAM...
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Cadence San Jose Hosts JEDEC LPDDR Task Group Meeting
Low-power DDR (LPDDR) SDRAM has been one of the most widely used memories in the semiconductor market today. It’s used in a diverse set of applications that spans mobile/handheld devices, IoT, client...
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Time-of-Flight Decoding with Tensilica Vision DSPs
Today, let's break down time-of-flight (ToF) and how Tensilica Vision DSPs can be leveraged for depth sensing.So, ToF? It's all about measuring depth. We've got two main types: Direct ToF (dToF) and...
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CadenceLIVE 2025: The Field Guide for Defense Digital Engineering
Modern microelectronics is a new operating theater for many in the Defense Industrial Base (DIB). It’s no longer a question of if but how to modernize. CadenceLIVE is replete with technical papers and...
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Linux-Based Audio Platform with Cadence Tensilica HiFi 5
A Linux-based audio platform with Cadence Tensilica HiFi 5 enables rapid algorithm development, reducing time to market. The audio technology sector is progressing swiftly, largely driven by a rising...
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Boosting AI Performance with CXL
As AI applications rapidly advance, AI models are being tasked with processing massive amounts of data containing billions – or even trillions – of parameters. Each large workload involves numerous...
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